VertaPrime PLP
Our VertaPrime PLP is an automated low vacuum vapor deposition tool suitable for a wide range of substrates, such as glass and CCL.
It hosts two process chambers, one with vapor deposition module for silane vapor deposition and the other for curing the panel. With its enhanced control of three temperature zones with thermocouple feedback this tool helps achieve superior WiW and WtW thermal uniformity.
YES’s unique low vacuum one-step cure rapidly removes solvent from films during ramp allowing early start of cure process leading to high productivity due to reduced process time. VertaPrime PLP is suitable for applications that enables adhesion promotion, anti-stiction surfaces for emerging technologies.
Values
Vapor deposition module
Dedicated chamber for uniform vapor deposition
Low vacuum one-step cure
High productivity due to reduced process time
Five-zone temperature control
≤1.5% temp uniformity with five-zone temperature control