SURE
Wet Processing Tool
General information
Wet chemistry tool capable of running multiple processes for either R&D or volume manufacturing.
Datasheet & Specs
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Values
Low COO
Low COO due to high throughput per footprint with efficient chemistry utilization.
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Versatile process capabilities
Standard cleans, metal etch (Cu, Ti, TiW, Al, etc.), glass etch for TGV and cavity creation, electroless plating, desmear and solvent processes
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Flexible configuration
System is configurable for batch or single wafer sizes from 100 mm to 300 mm, and panels up to 515 mm
Applications
Universities
R&D facilities
Pilot lines
Other products
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