VeroTherm FAR XP
General information
Our VeroTherm FAR XP system offers high precision and tunable process control, ensuring superior yield performance with bumps as small as 7 µm tall at 12 µm pitch.
Our unique single-step process offers high throughput with no defects and a minimal inter-metallic zone of less than 1 µm.
This process is qualified at the world’s largest IDM & HBM manufacturers, guaranteeing industry-leading reliability and efficiency.
Datasheet & Specs
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Values
High yield reflow performance
Single wafer vacuum reflow architecture enables excellent process sensitivity and control.
Lower cost of ownership
Single step process enables high throughput with high yield and a small footprint.
Technology extendibility
Able to process 7 µm bump at 12 µm pitch.
Applications
Solder Reflow – C4 bumps, Cu pillar
Chip-to-wafer and wafer-to-wafer bonding reflow
Thin die stacking reflow
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