We are Engineering the Intelligent Future

Who we are

We make semiconductor capital equipment that’s needed for AI LLMs and high performance computing

Our mission

YES is a leading provider of differentiated technologies for materials and interface engineering needed for a wide range of applications and markets.

YES customers are market leaders, creating next generation solutions for a variety of markets, including advanced packaging for AI and HPC, memory systems, and life sciences. YES is a leading manufacturer of state-of-the-art, cost-effective, high-volume production equipment for semiconductor advanced packaging solutions for wafers and glass panels.

Our products include: vacuum cure, coat, and anneal tools, fluxless reflow tools, through glass via, cavity etch, and electroless deposition tools for the semiconductor industry. YES is headquartered in Fremont, California, with a growing global presence.