TA Series
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General information
HMDS vacuum cure / vapor prime deposition system with the highest throughput and the lowest cost of ownership.
TA series are used for HMDS coating for photoresist adhesion promotion. Systems include the 310TA (up to 200 mm wafer size, ambient up to 160 ºC) and the 58TA (up to 300 mm wafer size, ambient up to 180 ºC).
Integrated image reversal process capability.
Datasheet & Specs
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Values
Exceptional cost of ownership
Large batch size capability and near-zero chemical waste.
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High yield
Superior HMDS bond and uniformity performance results in high yield.
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High reliability
>99% uptime and reliability with superior customer-proven uniformity and repeatability.
Applications
HMDS vapor deposition for photoresist adhesion
Substrate dehydration
Photoresist image reversal for metal lift-off processing
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