.webp)
Wafers
Runs two wafer sizes in parallel in large batch sizes.
Panels
Handles panel dimensions down to 200 μm thickness without breakage.
Copper Eless
Efficient electroless plating of copper for both surface bonding and glass core liner.
Values
.png)
Optimal on-board chemical management
.png)
Specialized handling with panel shock
.png)
Low COO with high throughput
Applications
Via liner
Build-up layers
Interconnects
Glass Etch
Tested on multiple commercially available substrates, the glass core etch can be specified for specific glass needs.
Values
Specialized glass panel handling
.png)
Optimized chemical usage
.png)
Onboard analysis and metrology
Applications
Through glass via etch
Glass cavity etch for embedded devices
ENEPIG / ENIG
Electroless plating processes for enhanced bonding in advanced packaging.
Values
Optimal on-board chemical management
Specialized handling with panel shock
Low COO with high throughput
Applications
Final layer interface for bonding
Extends package lifetime
Protects copper layers from oxidation
Metal Etch
Metal etch capability for Cu, Ti, TiW, Ru, and more.
Values
.png)
Multiple chemical processes available
Efficient onboard chemical management
.png)
Chemical cabinets available for bulk chemical delivery
Applications
Seed metal etch
Standard Cleans
Metal etch capability for Cu, Ti, TiW, Ru, and more.
Values
High efficiency processing
.png)
Ultrasonic and megasonic agitation available
.png)
Flexible setup for multiple processes
Applications
Front end particle cleans
.png)
-min.png)
-min.png)
-min.png)
-min.png)
