TersOra
Edge Zone Removal
General information
TersOra is a panel-level advanced packaging system for the removal of metals from the panel edges. It supports low particle contamination and a competitive cost of ownership.
State-of-the-art nozzle technology that etches the edge zone completely with no splashes or scratches to the substrate ensuring high yield and defect control.
Configurable to meet customer needs and works with EFEM and inline systems. Superior particle performance, key for advanced packaging needs.
Datasheet & Specs
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Values
Low COO
Superior COO due to high throughput per footprint with efficient chemistry utilization.
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Single-panel system
Single system to etch both top and bottom sides of the panel with no cleaning step needed.
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System configurable
Configurable to meet customer needs, and works with EFEM and inline systems.
Applications
CCL substrates
Metal (Ti, Cu) edge removal
Glass core and carrier substrates
Other products
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