TersOnus TGV and Cavity Etch
General information
Our high-throughput, low cost of ownership equipment affords an automated tool for all wet process for either panel or wafers.
Panels: Handles 510 × 515 mm panel dimensions, down to 200 µm thickness without breakage.
Wafers: Runs two wafer sizes in parallel, offering multiple dryer options for large batch sizes.
Datasheet & Specs
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Values
Process control
Offers tight temperature and fluid flow control.
Flexibility
Enables multiple substrate sizes and processes, tailored to customers’ processes and specifications.
Low cost of ownership
Reduces cost via high throughput and large batch sizes.
Applications
Electroless deposition
Metal / glass etch
Wet chemistries / clean / desmear / strip
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